Invention Grant
- Patent Title: Method for treating substrate, method for conveying substrate, and apparatus for conveying substrate
- Patent Title (中): 处理基板的方法，输送基板的方法以及输送基板的装置
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Application No.: US12261596Application Date: 2008-10-30
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Publication No.: US07973907B2Publication Date: 2011-07-05
- Inventor: Kentaro Matsunaga , Daisuke Kawamura , Seiro Miyoshi , Eishi Shiobara
- Applicant: Kentaro Matsunaga , Daisuke Kawamura , Seiro Miyoshi , Eishi Shiobara
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2007-282374 20071030
- Main IPC: G03B27/52
- IPC: G03B27/52
Abstract:
A method for treating a substrate before exposing the substrate to which a resist is applied, includes, rinsing the substrate to which a resist is applied, and holding the rinsed substrate in an atmosphere. The atmosphere substantially contains no moisture until conveying the substrate to an exposure apparatus.
Public/Granted literature
- US20090115978A1 METHOD FOR TREATING SUBSTRATE, METHOD FOR CONVEYING SUBSTRATE, AND APPARATUS FOR CONVEYING SUBSTRATE Public/Granted day:2009-05-07
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