Invention Grant
US07974023B1 Wafer level optical lens substrate, wafer level optical lens module and fabrication method thereof
有权
晶片级光学透镜基板,晶片级光学透镜模块及其制造方法
- Patent Title: Wafer level optical lens substrate, wafer level optical lens module and fabrication method thereof
- Patent Title (中): 晶片级光学透镜基板,晶片级光学透镜模块及其制造方法
-
Application No.: US12721567Application Date: 2010-03-11
-
Publication No.: US07974023B1Publication Date: 2011-07-05
- Inventor: Cheng-Heng Chen
- Applicant: Cheng-Heng Chen
- Applicant Address: TW Tainan
- Assignee: Himax Semiconductor, Inc.
- Current Assignee: Himax Semiconductor, Inc.
- Current Assignee Address: TW Tainan
- Agency: Jianq Chyun IP Office
- Main IPC: G02B7/02
- IPC: G02B7/02 ; G02B15/14 ; G02B27/10

Abstract:
A wafer level optical lens substrate including a substrate and at least one lens is provided. The substrate has at least one through hole and at least one flange, wherein each flange is located on a side wall in each through hole. Each lens located in each through hole is embedded with each flange. A method of fabricating a wafer level optical lens substrate and a wafer level optical lens module are also provided respectively.
Information query
IPC分类:
G | 物理 |
G02 | 光学 |
G02B | 光学元件、系统或仪器 |
G02B7/00 | 光学元件的安装、调整装置或不漏光连接 |
G02B7/02 | .用于透镜 |