Invention Grant
- Patent Title: Acoustic cleaning system for electronic components
- Patent Title (中): 电子元件声学清洗系统
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Application No.: US12497842Application Date: 2009-07-06
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Publication No.: US07975710B2Publication Date: 2011-07-12
- Inventor: Hon Keung Lai , Hoi Shuen Tang , Wang Lung Tse
- Applicant: Hon Keung Lai , Hoi Shuen Tang , Wang Lung Tse
- Applicant Address: HK Hong Kong
- Assignee: ASM Assembly Automation Ltd
- Current Assignee: ASM Assembly Automation Ltd
- Current Assignee Address: HK Hong Kong
- Agency: Ostrolenk Faber LLP
- Main IPC: B08B3/00
- IPC: B08B3/00 ; B08B3/12 ; B08B6/00

Abstract:
An apparatus for cleaning electronic packages comprises a tank containing cleaning fluid and a holder above the tank that supports the electronic packages above a top surface of the cleaning fluid with the electronic packages facing the cleaning fluid. Acoustic energy generators are immersed in the cleaning fluid for generating and propagating acoustic energy towards the top surface of the cleaning fluid to create streaming fluid jets projecting upwardly at the top surface to contact and clean the electronic packages supported on the holder.
Public/Granted literature
- US20110000503A1 ACOUSTIC CLEANING SYSTEM FOR ELECTRONIC COMPONENTS Public/Granted day:2011-01-06
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