Invention Grant
- Patent Title: Nano-molding process
- Patent Title (中): 纳米成型工艺
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Application No.: US12065769Application Date: 2005-09-15
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Publication No.: US07976748B2Publication Date: 2011-07-12
- Inventor: John Rogers , Feng Hua , Anne Shim
- Applicant: John Rogers , Feng Hua , Anne Shim
- Applicant Address: US IL Urbana US MI Midland
- Assignee: The Board of Trustees of The University of Illinois,Dow Corning Corporation
- Current Assignee: The Board of Trustees of The University of Illinois,Dow Corning Corporation
- Current Assignee Address: US IL Urbana US MI Midland
- Agency: Dinsmore & Shohl LLP
- International Application: PCT/US2005/032852 WO 20050915
- International Announcement: WO2007/043987 WO 20070419
- Main IPC: B29C33/40
- IPC: B29C33/40 ; B29C43/02 ; B29C43/58

Abstract:
A nano-molding process including an imprint process that replicates features sizes less than 7 nanometers. The nano-molding process produces a line edge roughness of the replicated features that is less than 2 nanometers. The nano-molding process including the steps of: a) forming a first substrate having nano-scale features formed thereon, b) casting at least one polymer against the substrate, c) curing the at least one polymer forming a mold, d) removing the mold from the first substrate, e) providing a second substrate having a molding material applied thereon, f) pressing the mold against the second substrate allowing the molding material to conform to a shape of the mold, g) curing the molding material, and h) removing the mold from the second substrate having the cured molding material revealing a replica of the first substrate.
Public/Granted literature
- US20080224358A1 Nano-Molding Process Public/Granted day:2008-09-18
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