发明授权
- 专利标题: Semiconductor substrate and semiconductor device
- 专利标题(中): 半导体衬底和半导体器件
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申请号: US12277749申请日: 2008-11-25
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公开(公告)号: US07977210B2公开(公告)日: 2011-07-12
- 发明人: Chiharu Ota , Johji Nishio , Takashi Shinohe
- 申请人: Chiharu Ota , Johji Nishio , Takashi Shinohe
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Ohlandt, Greeley, Ruggiero & Perle, L.L.P.
- 优先权: JP2007-306029 20071127
- 主分类号: H01L21/30
- IPC分类号: H01L21/30
摘要:
A semiconductor substrate includes a silicon carbide substrate having a first impurity concentration, a first silicon carbide layer formed on the silicon carbide substrate and having a second impurity concentration, and a second silicon carbide layer of a first conductivity type formed on the first silicon carbide layer and having a third impurity concentration, wherein the second impurity concentration is higher the an either the first impurity concentration or the third impurity concentration.
公开/授权文献
- US20090134405A1 SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR DEVICE 公开/授权日:2009-05-28
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