Invention Grant
- Patent Title: Silicone rubber composition for extrusion molding
- Patent Title (中): 硅橡胶组合物用于挤出成型
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Application No.: US12630080Application Date: 2009-12-03
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Publication No.: US07977417B2Publication Date: 2011-07-12
- Inventor: Daichi Todoroki
- Applicant: Daichi Todoroki
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-244945 20060911
- Main IPC: C08K5/5419
- IPC: C08K5/5419 ; C08K3/36

Abstract:
Provided is a silicone rubber composition for extrusion molding, including: (A) 100 parts by mass of an organopolysiloxane represented by an average composition formula (1): R1nSiO(4-n)/2 (in the formula, R1 represents identical or different, unsubstituted or substituted monovalent hydrocarbon groups, and n represents a positive number within a range from 1.95 to 2.04), (B) 0 to 50 parts by mass of a vinyl group-containing silicon compound, (C) 5 to 100 parts by mass of a reinforcing silica, and (D) an effective quantity of a curing agent, in which the vinyl group content relative to the combination of the components (A) through (D) is at least 1.0×10−4 mol/g. The composition yields a cured product for which the elastic modulus increases across a temperature range from 30 to 110° C. and which is therefore capable of reducing the temperature dependency of acrylic optical fibers. The composition is suitable for extrusion molding.
Public/Granted literature
- US20100080999A1 SILICONE RUBBER COMPOSITION FOR EXTRUSION MOLDING Public/Granted day:2010-04-01
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