发明授权
- 专利标题： Integrated circuit chip component, multi-chip module, their integration structure, and their fabrication method
- 专利标题（中）： 集成电路芯片组件，多芯片模块，其集成结构及其制造方法
-
申请号： US11995356申请日： 2006-07-14
-
公开(公告)号： US07977801B2公开(公告)日： 2011-07-12
- 发明人: Ryo Takatsuki
- 申请人： Ryo Takatsuki
- 申请人地址： JP Oita-Ken
- 专利权人： Ryo Takatsuki
- 当前专利权人： Ryo Takatsuki
- 当前专利权人地址： JP Oita-Ken
- 代理机构： Lackenbach Siegel, LLP
- 代理商 Andrew F. Young, Esq.
- 优先权： JP2005-206318 20050715; JP2005-227396 20050805; JP2006-092378 20060329
- 国际申请： PCT/JP2006/314081 WO 20060714
- 国际公布： WO2007/010863 WO 20070125
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A multi-chip module and an integrated structure of the present invention including: at least one of either a terminal unit formation area expanded type integrated circuit chip, or a terminal unit formation area identical type integrated circuit chip; terminal unit formation areas of these integrated circuits that are covered with protective layers, and expanded wiring units and terminal units formed in the protective layers; one or a plurality of the terminal unit formation area expanded type and the terminal unit formation area identical type integrated circuit chip components that are two-dimensionally or three-dimensionally aligned in further protective layers; a horizontal or a vertical wiring formed for arbitrarily connecting the plurality of the integrated circuit chip components in the further protective layers.
公开/授权文献
信息查询
IPC分类:
