A monitoring apparatus for sensing conditions associated with a package handling system. The monitoring apparatus includes a test package configured for being handled by the package handling system with non-test packages handled by the package handling system. The test package has a housing defining a test package interior and has at least one sensor positioned within the interior for sensing conditions associated with the package handling system. The sensor produces an output signal corresponding to the conditions that it senses. The test package further includes a support positioned within the test package interior and connecting the sensor to the housing so that the sensor is directed generally toward an outside of the test package for sensing conditions associated with the package handling system.