Invention Grant
- Patent Title: Printed circuit board with embedded cavity capacitor
- Patent Title (中): 带嵌入式腔体电容器的印刷电路板
-
Application No.: US12010436Application Date: 2008-01-24
-
Publication No.: US07983055B2Publication Date: 2011-07-19
- Inventor: Han Kim , Je-Gwang Yoo , Chang-Sup Ryu
- Applicant: Han Kim , Je-Gwang Yoo , Chang-Sup Ryu
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2007-0097720 20070928
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01L27/108

Abstract:
A printed circuit board having an embedded cavity capacitor is disclosed. According to an embodiment of the present invention, the printed circuit board having the embedded cavity capacitor, the printed circuit board can include two conductive layers to be used as a power layer and a ground layer, respectively; and a first dielectric layer, placed between the two conductive layers, wherein at least one cavity capacitor is arranged in a noise-transferable path between a noise source and a noise prevented destination which are placed on the printed circuit board, the cavity capacitor being formed to allow a second dielectric layer to have a lower stepped region than the first dielectric layer, the second dielectric layer using the two conductive layers as a first electrode and a second electrode, respectively, and placed between the first electrode and the second electrode.
Public/Granted literature
- US20090086451A1 Printed circuit board with embedded cavity capacitor Public/Granted day:2009-04-02
Information query