发明授权
- 专利标题: Solder ball attachment ring and method of use
- 专利标题(中): 焊球安装环及使用方法
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申请号: US11946056申请日: 2007-11-28
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公开(公告)号: US07985672B2公开(公告)日: 2011-07-26
- 发明人: Poh Leng Eu , Lan Chu Tan , Cheng Qiang Cui
- 申请人: Poh Leng Eu , Lan Chu Tan , Cheng Qiang Cui
- 申请人地址: US TX Austin
- 专利权人: Freescale Semiconductor, Inc.
- 当前专利权人: Freescale Semiconductor, Inc.
- 当前专利权人地址: US TX Austin
- 代理商 Charles Bergere
- 主分类号: H01L21/44
- IPC分类号: H01L21/44
摘要:
A method of attaching a solder ball to a bonding pad includes disposing flux on the bonding pad, attaching a conductive metal ring to the pad using the flux, and placing the solder ball in the ring. A reflow operation is performed that secures the ring to the pad and melts the solder ball into and around the ring. A solder joint is formed between solder ball and the pad, with the ring secured within the ball. Use of the ring allows for higher stand-off height to be achieved with similar solder ball size, without having to use bigger ball size as in the conventional method, which causes solder ball bridging. With higher stand-off height, better board level reliability performance can be obtained.
公开/授权文献
- US20090134207A1 SOLDER BALL ATTACHMENT RING AND METHOD OF USE 公开/授权日:2009-05-28
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