发明授权
- 专利标题： Wire bond interconnection
- 专利标题（中）： 电线互连
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申请号： US12783039申请日： 2010-05-19
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公开(公告)号： US07986047B2公开(公告)日： 2011-07-26
- 发明人: Hun-Teak Lee , Jong-Kook Kim , Chul-Sik Kim , Ki-Youn Jang , Rajendra D. Pendse
- 申请人： Hun-Teak Lee , Jong-Kook Kim , Chul-Sik Kim , Ki-Youn Jang , Rajendra D. Pendse
- 申请人地址： US CA Fremont
- 专利权人： Chippac, Inc.
- 当前专利权人： Chippac, Inc.
- 当前专利权人地址： US CA Fremont
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52
摘要：
A wire bond interconnection between a die pad and a bond finger includes a support pedestal at a bond site of the lead finger, a ball bond on the die pad, and a stitch bond on the support pedestal, in which a width of the lead finger at the bond site is less than a diameter of the support pedestal. Also, a semiconductor package including a die mounted onto and electrically connected by a plurality of wire bonds to a substrate, in which each of the wire bonds includes a wire ball bonded to a pad on the die and stitch bonded to a support pedestal on a bond site on a lead finger, and in which the width of the lead finger at the bond site is less than the diameter of the support pedestal.
公开/授权文献
- US20100225008A1 WIRE BOND INTERCONNECTION 公开/授权日：2010-09-09