Invention Grant
- Patent Title: Engaging structure for electronic device
- Patent Title (中): 电子设备接合结构
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Application No.: US12337744Application Date: 2008-12-18
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Publication No.: US07986516B2Publication Date: 2011-07-26
- Inventor: Pen-Uei Lu
- Applicant: Pen-Uei Lu
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Chi Mei Communication Systems, Inc.
- Current Assignee: Chi Mei Communication Systems, Inc.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agent Steven M. Reiss
- Priority: CN200810304261 20080828
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/00 ; H05K7/00 ; H04M1/00

Abstract:
An engaging structure for an electronic device includes a first substrate, an engaging member, and a fixed reinforcing member. The first substrate defines at least one guiding slot. The engaging member includes at least one first latching protrusion extending therefrom. The at least one first protrusion engages in the at least one guiding slot. The fixed reinforcing member includes at least one abutting block extending therefrom. The at least one abutting block is configured for abutting against the at least one first latching protrusion.
Public/Granted literature
- US20100053856A1 ENGAGING STRUCTURE FOR ELECTRONIC DEVICE Public/Granted day:2010-03-04
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