发明授权
US07988886B2 Conductive pattern forming ink, conductive pattern and wiring substrate
失效
导电图案形成油墨，导电图案和布线基板
- 专利标题： Conductive pattern forming ink, conductive pattern and wiring substrate
- 专利标题（中）： 导电图案形成油墨，导电图案和布线基板
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申请号： US12326715申请日： 2008-12-02
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公开(公告)号： US07988886B2公开(公告)日： 2011-08-02
- 发明人: Naoyuki Toyoda
- 申请人： Naoyuki Toyoda
- 申请人地址： JP Tokyo
- 专利权人： Seiko Epson Corporation
- 当前专利权人： Seiko Epson Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Global IP Counselors, LLP
- 优先权： JP2007-319019 20071210
- 主分类号： H01B1/20
- IPC分类号： H01B1/20
摘要：
A conductive pattern forming ink for forming a conductive pattern on a substrate by a droplet discharge method includes: metal particles; an aqueous dispersion medium in which the metal particles are dispersed; inositol; and a polyglycerol compound having a polyglycerol skeleton. In the ink, H shown in the following formula (I) is 0.050 to 0.70; H = OH ( A ) Mw ( A ) X ( A ) + OH ( B ) Mw ( B ) X ( B ) Formula ( I ) where OH(A) represents an average number of hydroxyl groups in one molecule of the polyglycerol compound, Mw(A) represents a weight-average molecular weight of the polyglycerol compound, X(A) represents a content of the polyglycerol compound in the conductive pattern forming ink in weight percent; and OH(B) represents a number of hydroxyl groups in one molecule of the inositol, Mw(B) represents a molecular weight of the inositol, and X(B) represents a content of the inositol in the conductive pattern forming ink in weight percent.