Invention Grant
- Patent Title: Insert-molded cover and method for manufacturing same
- Patent Title (中): 嵌入成型盖及其制造方法
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Application No.: US12187397Application Date: 2008-08-07
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Publication No.: US07989079B2Publication Date: 2011-08-02
- Inventor: Han-Ming Lee , Chih-Chien Hung , Hsiang-Sheng Chou , Ching-Hsien Chang
- Applicant: Han-Ming Lee , Chih-Chien Hung , Hsiang-Sheng Chou , Ching-Hsien Chang
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Foxconn Technology Co., Ltd.
- Current Assignee: Foxconn Technology Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agent Zhigang Ma
- Priority: CN200810301531 20080509
- Main IPC: B32B15/04
- IPC: B32B15/04
Abstract:
An exemplary insert-molded cover (10) for electronic devices includes a metallic body (11), a plastic antenna lid (12) integrally formed with the metallic body and an oxide film (12) formed on a surface (111) of the metallic body for attaching the plastic antenna lid. The present invention also relates a method for manufacturing the insert-molded cover for electronic devices.
Public/Granted literature
- US20090280340A1 INSERT-MOLDED COVER AND METHOD FOR MANUFACTURING SAME Public/Granted day:2009-11-12
Information query
