Invention Grant
- Patent Title: Housing of electronic device and electronic device using the same
- Patent Title (中): 电子设备的壳体和使用它的电子设备
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Application No.: US12275315Application Date: 2008-11-21
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Publication No.: US07989085B2Publication Date: 2011-08-02
- Inventor: Bin Li , Chao-Hsun Lin , Jen-Lung Huang , Xian-Liang Liu , Gui-Yun Yang
- Applicant: Bin Li , Chao-Hsun Lin , Jen-Lung Huang , Xian-Liang Liu , Gui-Yun Yang
- Applicant Address: CN ShenZhen, Guangdong Province KH Kowloon
- Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee Address: CN ShenZhen, Guangdong Province KH Kowloon
- Agent Steven M. Reiss
- Priority: CN200810303278 20080731
- Main IPC: B21D39/00
- IPC: B21D39/00 ; B32B15/00
Abstract:
An exemplary housing of electronic device includes a metallic main body and a metallic three-dimensional woven member formed on at least a part of a surface of the metallic main body. An electronic device using the housing is also provided. The housing of the electronic device has a textured touching feeling.
Public/Granted literature
- US20100028709A1 HOUSING OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE USING THE SAME Public/Granted day:2010-02-04
Information query
