A method for fabricating an LCD device is disclosed, in which a reliable thin film pattern is formed as process deviation is minimized. The method includes forming a thin film on a substrate; forming an etch resist solution on the thin film; applying a soft mold having a concave portion and a convex portion to the etch resist solution, wherein the convex portion includes a first width and a second width different than the first width; forming an etch resist pattern having a predetermined linewidth controlled by the pressure applied by the soft mold; hardening the etch resist pattern; separating the soft mold from the substrate; and patterning the thin film using the etch resist pattern as a mask.