发明授权
- 专利标题: Asymmetric epitaxy and application thereof
- 专利标题(中): 不对称外延及其应用
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申请号: US12614699申请日: 2009-11-09
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公开(公告)号: US07989297B2公开(公告)日: 2011-08-02
- 发明人: Haizhou Yin , Xinhui Wang , Kevin K. Chan , Zhibin Ren
- 申请人: Haizhou Yin , Xinhui Wang , Kevin K. Chan , Zhibin Ren
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理商 Yuanmin Cai
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
The present invention provides a method of forming asymmetric field-effect-transistors. The method includes forming a gate structure on top of a semiconductor substrate, the gate structure including a gate stack and spacers adjacent to sidewalls of the gate stack, and having a first side and a second side opposite to the first side; performing angled ion-implantation from the first side of the gate structure in the substrate, thereby forming an ion-implanted region adjacent to the first side, wherein the gate structure prevents the angled ion-implantation from reaching the substrate adjacent to the second side of the gate structure; and performing epitaxial growth on the substrate at the first and second sides of the gate structure. As a result, epitaxial growth on the ion-implanted region is much slower than a region experiencing no ion-implantation. A source region formed to the second side of the gate structure by the epitaxial growth has a height higher than a drain region formed to the first side of the gate structure by the epitaxial growth. A semiconductor structure formed thereby is also provided.
公开/授权文献
- US20110108918A1 ASYMMETRIC EPITAXY AND APPLICATION THEREOF 公开/授权日:2011-05-12
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