The invention relates to improved resin bonded sorbent compositions and articles of manufacture fabricated therewith, such as housings, structural components and circuit boards. The introduction of sorbents into resinous molding compositions enables the elimination of more conventional bagged sorbent containments. The novel molding compositions of the invention and parts fabricated therewith are multi-functional, beneficially combining structural, mechanical and adsorptive capabilities without requiring the usual reinforcing additives. Consequently, with the omission of reinforcing additives the novel molding compositions of the invention are further characterized by higher adsorptive capacities by allowing for higher sorbent loading factors than prior adsorbent-containing molding compositions.