Invention Grant
- Patent Title: Fabricating arrays of metallic nanostructures
- Patent Title (中): 制造金属纳米结构阵列
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Application No.: US12509689Application Date: 2009-07-27
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Publication No.: US07989798B2Publication Date: 2011-08-02
- Inventor: Philip J Kuekes , M. Saif Islam , Shih-Yuan Wang , Alexandre M. Bratkovski
- Applicant: Philip J Kuekes , M. Saif Islam , Shih-Yuan Wang , Alexandre M. Bratkovski
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H01L29/06
- IPC: H01L29/06
Abstract:
A patterned array of metallic nanostructures and fabrication thereof is described. A device comprises a patterned array of metallic columns vertically extending from a substrate. Each metallic column is formed by metallically coating one of an array of non-metallic nanowires catalytically grown from the substrate upon a predetermined lateral pattern of seed points placed thereon according to a nanoimprinting process. An apparatus for fabricating a patterned array of metallic nanostructures is also described.
Public/Granted literature
- US20090294755A1 Fabricating Arrays Of Metallic Nanostructures Public/Granted day:2009-12-03
Information query
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