Invention Grant
- Patent Title: Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wire
- Patent Title (中): 半导体封装，其包括位于封装基板之间的绝缘层，其可以防止由接合线引起的电短路
-
Application No.: US12549033Application Date: 2009-08-27
-
Publication No.: US07989939B2Publication Date: 2011-08-02
- Inventor: Hyun-Ik Hwang , YongJin Jung , Kunho Song
- Applicant: Hyun-Ik Hwang , YongJin Jung , Kunho Song
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2008-0087451 20080904
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/49
Abstract:
Provided is a semiconductor package. The semiconductor package includes a bonding wire electrically connecting a first package substrate and a second package substrate to each other and an insulating layer adhering the first package substrate and the second package substrate to each other and covering a portion of the bonding wire.
Public/Granted literature
- US20100052130A1 SEMICONDUCTOR PACKAGE AND METHODS FOR MANUFACTURING THE SAME Public/Granted day:2010-03-04
Information query
IPC分类:
