发明授权
- 专利标题： Electronic device enclosure
- 专利标题（中）： 电子设备外壳
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申请号： US12482906申请日： 2009-06-11
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公开(公告)号： US07990735B2公开(公告)日： 2011-08-02
- 发明人: Chin-Wen Yeh , Zhi-Jian Peng , Hai-Shan Sun
- 申请人： Chin-Wen Yeh , Zhi-Jian Peng , Hai-Shan Sun
- 申请人地址： CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- 专利权人： Hong Fu Jin Precision Industry (Shen Zhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人： Hong Fu Jin Precision Industry (Shen Zhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人地址： CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- 代理商 D. Austin Bonderer
- 优先权： CN200820303728U 20081226
- 主分类号： H05K7/14
- IPC分类号： H05K7/14 ; H05K7/18
摘要：
An enclosure for an electronic device includes a chassis and a cover. The chassis includes a bottom wall and an opening. A circuit board is mounted on the bottom wall. The cover is mounted on the chassis to cover the opening of the chassis. A fixing apparatus is movably mounted on the cover. The fixing apparatus contacts and biases the expansion card toward the circuit board.
公开/授权文献
- US20100165591A1 ELECTRONIC DEVICE ENCLOSURE 公开/授权日：2010-07-01
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