发明授权
- 专利标题： Lead free alloy bump structure and fabrication method
- 专利标题（中）： 无铅合金凸块结构及制造方法
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申请号： US12108909申请日： 2008-04-24
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公开(公告)号： US07994043B1公开(公告)日： 2011-08-09
- 发明人: J. Daniel Mis , Glenn A. Rinne
- 申请人： J. Daniel Mis , Glenn A. Rinne
- 申请人地址： US AZ Chandler
- 专利权人： Amkor Technology, Inc.
- 当前专利权人： Amkor Technology, Inc.
- 当前专利权人地址： US AZ Chandler
- 代理机构： Gunnison, McKay & Hodgson, L.L.P.
- 代理商 Serge J. Hodgson
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
A method includes forming a patterned resist layer comprising a resist layer opening overlying a bond pad of a substrate. The resist layer opening is at least partially filled with a first solder component layer. A second solder component layer is formed on the first solder component layer. The patterned resist layer is removed. The first solder component layer and the second solder component layer are reflowed to form a lead free binary metal alloy solder bump electrically connected to the bond pad.