发明授权
- 专利标题： Curable silicone composition and electronic component
- 专利标题（中）： 可固化有机硅组合物和电子元件
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申请号： US12520899申请日： 2007-12-14
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公开(公告)号： US07994246B2公开(公告)日： 2011-08-09
- 发明人: Yoshitsugu Morita , Tomoko Kato
- 申请人： Yoshitsugu Morita , Tomoko Kato
- 申请人地址： JP Chiyoda-Ku, Tokyo
- 专利权人： Dow Corning Toray Company, Ltd.
- 当前专利权人： Dow Corning Toray Company, Ltd.
- 当前专利权人地址： JP Chiyoda-Ku, Tokyo
- 代理机构： Howard & Howard Attorneys PLLC
- 优先权： JP2006-346865 20061225
- 国际申请： PCT/JP2007/074607 WO 20071214
- 国际公布： WO2008/078663 WO 20080703
- 主分类号： C08K5/1515
- IPC分类号： C08K5/1515 ; C08K5/16
摘要：
A curable silicone composition comprising at least the following components: (A) an epoxy-containing organopolysiloxane; (B) a curing agent for epoxy resin; and (C) an epoxy compound represented by the specific general formula; is characterized by excellent handleability and reduced oil-bleeding, and, when cured, forms a cured body of excellent flexibility and adhesion.
公开/授权文献
- US20100063185A1 Curable Silicone Composition and Electronic Component 公开/授权日：2010-03-11