发明授权
- 专利标题： Bridge stack integrated circuit package system
- 专利标题（中）： 桥式堆栈集成电路封装系统
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申请号： US11555682申请日： 2006-11-01
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公开(公告)号： US07994619B2公开(公告)日： 2011-08-09
- 发明人: Richard P. Sheridan , Eric Gongora , Douglas J. Mathews
- 申请人： Richard P. Sheridan , Eric Gongora , Douglas J. Mathews
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理商 Mikio Ishimaru
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
An integrated circuit package system is provided including mounting a first device on a carrier, mounting a second device over the first device and the carrier in an offset face-to-face configuration, and connecting the first device and the second device at an overlap.
公开/授权文献
- US20080111222A1 BRIDGE STACK INTEGRATED CIRCUIT PACKAGE SYSTEM 公开/授权日：2008-05-15
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