发明授权
- 专利标题： Integrated circuit package system with adhesive segment spacer
- 专利标题（中）： 集成电路封装系统，具有粘接段隔离
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申请号： US12237344申请日： 2008-09-24
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公开(公告)号： US07994624B2公开(公告)日： 2011-08-09
- 发明人: Linda Pei Ee Chua , Byung Tai Do , Reza Argenty Pagaila
- 申请人： Linda Pei Ee Chua , Byung Tai Do , Reza Argenty Pagaila
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理商 Mikio Ishimaru
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
An integrated circuit package system includes attaching an adhesive segment spacer to an interposer assembly; mounting an integrated circuit over a carrier; mounting the interposer assembly over the integrated circuit with the adhesive segment spacer exposing an inner region of the integrated circuit and covering a periphery of the integrated circuit; and forming an encapsulation over the integrated circuit, the interposer assembly, and the adhesive segment spacer with the interposer assembly exposed with a recess in the encapsulation.