Invention Grant
- Patent Title: Power supply system and method
- Patent Title (中): 电源系统及方法
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Application No.: US12551463Application Date: 2009-08-31
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Publication No.: US07994656B2Publication Date: 2011-08-09
- Inventor: Tsung-Sheng Huang , Chun-Jen Chen , Duen-Yi Ho
- Applicant: Tsung-Sheng Huang , Chun-Jen Chen , Duen-Yi Ho
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agent Zhigang Ma
- Priority: CN200910304544 20090720
- Main IPC: H02J1/00
- IPC: H02J1/00

Abstract:
A power supply system includes a power supply, a daughterboard, and a motherboard. Output currents of power connectors of the motherboard and impedances of copper foils between every two adjacent power connectors of the motherboard are obtained via simulation. A voltage of one power connector of the motherboard is predetermined. Therefore, desired impedances of copper foils between VRM connectors and corresponding power connectors on the daughter board are determined via calculations, to make currents passing through the power connectors of the motherboard equal to each other.
Public/Granted literature
- US20110012426A1 POWER SUPPLY SYSTEM AND METHOD Public/Granted day:2011-01-20
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