发明授权
- 专利标题: Method and apparatus for securely dechucking wafers
- 专利标题(中): 用于安全地脱扣晶片的方法和装置
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申请号: US12172669申请日: 2008-07-14
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公开(公告)号: US07995323B2公开(公告)日: 2011-08-09
- 发明人: Chung-Tsung Lu , Pin-Chia Su , Yu-Chih Liou
- 申请人: Chung-Tsung Lu , Pin-Chia Su , Yu-Chih Liou
- 申请人地址: TW Hsin-Chu US CA Fremont
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.,Lam Research
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.,Lam Research
- 当前专利权人地址: TW Hsin-Chu US CA Fremont
- 代理机构: Thomas|Kayden
- 主分类号: H01L21/683
- IPC分类号: H01L21/683 ; H01T23/00
摘要:
A wafer stage installed in a process chamber for safely dechucking a wafer is provided. In one embodiment, the wafer stage comprises: a chuck support for supporting a chuck; a chuck mounted on the chuck support for receiving and attaching a wafer thereto; a support lift means for supporting the wafer; a driving means coupled to the support lift means for gradually raising the support lift means to contact the wafer in response to a variable quantity; a controller for receiving the variable quantity; and a regulating means coupled to the driving means and to the controller, the regulating means for controlling the variable quantity going to the driving means when a predetermined variable quantity is detected.
公开/授权文献
- US20100008014A1 METHOD AND APPARATUS FOR SUCURELY DECHUCKING WAFERS 公开/授权日:2010-01-14
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