Invention Grant
- Patent Title: Method for electrochemical fabrication
- Patent Title (中): 电化学制造方法
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Application No.: US12698026Application Date: 2010-02-01
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Publication No.: US07998331B2Publication Date: 2011-08-16
- Inventor: Adam L. Cohen
- Applicant: Adam L. Cohen
- Applicant Address: US CA Los Angeles
- Assignee: University of Southern California
- Current Assignee: University of Southern California
- Current Assignee Address: US CA Los Angeles
- Agent Dennis R. Smalley
- Main IPC: C25D5/02
- IPC: C25D5/02

Abstract:
An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
Public/Granted literature
- US20100193366A1 Method For Electrochemical Fabrication Public/Granted day:2010-08-05
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