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US07999400B2 Semiconductor device with recessed registration marks partially covered and partially uncovered 有权
具有凹入对准标记的半导体器件被部分覆盖并部分地覆盖

  • 专利标题： Semiconductor device with recessed registration marks partially covered and partially uncovered
  • 专利标题（中）： 具有凹入对准标记的半导体器件被部分覆盖并部分地覆盖
  • 申请号： US11884450
    申请日： 2006-01-30
  • 公开(公告)号： US07999400B2
    公开(公告)日： 2011-08-16
  • 发明人: Takashi Itoga , Yasuyuki Ogawa
  • 申请人： Takashi Itoga , Yasuyuki Ogawa
  • 申请人地址： JP Osaka
  • 专利权人： Sharp Kabushiki Kaisha
  • 当前专利权人： Sharp Kabushiki Kaisha
  • 当前专利权人地址： JP Osaka
  • 代理机构： Nixon & Vanderhye P.C.
  • 优先权： JP2005-089808 20050325
  • 国际申请： PCT/JP2006/301490 WO 20060130
  • 国际公布： WO2006/103825 WO 20061005
  • 主分类号： H01L23/544
  • IPC分类号： H01L23/544
Semiconductor device with recessed registration marks partially covered and partially uncovered
摘要：
A semiconductor device and a method for manufacturing such semiconductor device are provided. Specifically, in the semiconductor manufacture, a recessed alignment mark is formed on a front plane of a high distortion point glass substrate as a target for alignment for bonding, and the recessed alignment mark is permitted to have a shape which extends to an external side of the semiconductor device. Thus, excellent bonding between the high distortion point glass substrate and the semiconductor device can be provided, and at the same time, since the recessed alignment mark is not sealed, the bonding state can be maintained even when the high distortion point glass substrate is exposed under the high temperature condition after bonding the semiconductor device.
摘要（中）：

提供一种半导体器件及其制造方法。 具体地说，在半导体制造中，在作为接合对准的目标的高失真点玻璃基板的正面上形成凹陷的对准标记，并且允许凹入的对准标记具有延伸到 半导体器件。 因此，可以提供高失真点玻璃基板与半导体器件之间的良好的接合，并且同时由于凹入的对准标记未被密封，所以即使当高变形点玻璃基板被暴露时，也可以保持接合状态 在接合半导体器件之后的高温条件下。

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