Invention Grant
- Patent Title: Method and apparatus for enhanced packaging for PC security
- Patent Title (中): 用于PC安全性增强包装的方法和装置
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Application No.: US11763820Application Date: 2007-06-15
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Publication No.: US08000108B2Publication Date: 2011-08-16
- Inventor: Shon Schmidt , Nicholas Temple , Kurt A. Jenkins , Thomas Patrick Lennon , David Michael Lane
- Applicant: Shon Schmidt , Nicholas Temple , Kurt A. Jenkins , Thomas Patrick Lennon , David Michael Lane
- Applicant Address: US WA Redmond
- Assignee: Microsoft Corporation
- Current Assignee: Microsoft Corporation
- Current Assignee Address: US WA Redmond
- Main IPC: H01R12/16
- IPC: H01R12/16
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Abstract:
A method having a socket for coupling signals between an electrical component and a circuit board or equivalent has a mechanism that, when activated, attaches the electrical component to the socket so that it is not possible to remove the electrical component without damaging it. The mechanism may include a clamshell lid with a one-time locking mechanism, a pin contact mechanism that, after initial locking, will detach the pins of the electrical component if further disturbed, or a moat around the base of the electrical component for disposing an epoxy fastener. The moat may include a heating element to cure the epoxy or other glue. The socket may include an electrical component that allows detection of tampering with the socket.
Public/Granted literature
- US20080310127A1 Enhanced packaging for PC security Public/Granted day:2008-12-18
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