Invention Grant
US08003412B2 Method and apparatus for measurement and control of photomask to substrate alignment
失效
用于测量和控制光掩模到衬底对准的方法和装置
- Patent Title: Method and apparatus for measurement and control of photomask to substrate alignment
- Patent Title (中): 用于测量和控制光掩模到衬底对准的方法和装置
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Application No.: US12888600Application Date: 2010-09-23
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Publication No.: US08003412B2Publication Date: 2011-08-23
- Inventor: Axel A. Granados , Benjamin A. Fox , Nathaniel J. Gibbs , Andrew B. Maki , Trevor J. Timpane
- Applicant: Axel A. Granados , Benjamin A. Fox , Nathaniel J. Gibbs , Andrew B. Maki , Trevor J. Timpane
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Schmeiser, Olsen & Watts
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method, structure, system of aligning a substrate to a photomask. The method comprising: directing light through a clear region of the photomask in a photolithography tool, through a lens of the tool and onto a set of at least three diffraction mirror arrays on the substrate, each diffraction mirror array of the set of at least three diffraction minor arrays comprising a single row of mirrors, all mirrors in any particular diffraction mirror array spaced apart a same distance, mirrors in different diffraction mirror arrays spaced apart different distances; measuring an intensity of light diffracted from the set of at least three diffraction mirror arrays onto an array of photo detectors; and adjusting a temperature of the photomask or photomask and lens based on the measured intensity of light.
Public/Granted literature
- US20110008719A1 METHOD AND APPARATUS FOR MEASUREMENT AND CONTROL OF PHOTOMASK TO SUBSTRATE ALIGNMENT Public/Granted day:2011-01-13
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