Invention Grant
US08003498B2 Particle beam assisted modification of thin film materials 有权
粒子束辅助修饰薄膜材料

Particle beam assisted modification of thin film materials
Abstract:
Several examples of a method for processing a substrate are disclosed. In a particular embodiment, the method may include: introducing a plurality of first particles to a first region of the substrate so as to form at least one crystal having a grain boundary in the first region without forming another crystal in a second region, the second region adjacent to the first region; and extending the grain boundary of the at least one crystal formed in the first region to the second region after stopping the introducing the plurality of first particles.
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