发明授权
- 专利标题: Structure of UBM and solder bumps and methods of fabrication
- 专利标题(中): UBM和焊料凸块的结构和制造方法
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申请号: US12364684申请日: 2009-02-03
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公开(公告)号: US08003512B2公开(公告)日: 2011-08-23
- 发明人: Luc L. Belanger , Marc A. Bergendahl , Ajay P. Giri , Paul A. Lauro , Valerie A. Oberson , Da-Yuan Shih
- 申请人: Luc L. Belanger , Marc A. Bergendahl , Ajay P. Giri , Paul A. Lauro , Valerie A. Oberson , Da-Yuan Shih
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: DeLio & Peterson, LLC
- 代理商 Kelly M. Nowak; Joseph Petrokaitis
- 主分类号: H01L21/44
- IPC分类号: H01L21/44
摘要:
Methods and UBM structures having bilayer or trilayer UBM layers that include a thin TiW adhesion layer and a thick Ni-based barrier layer thereover both deposited under sputtering operating conditions that provide the resultant bilayer or trilayer UBM layers with minimal composite stresses. The Ni-based barrier layer may be pure Ni or a Ni alloy. These UBM layers may be patterned to fabricate bilayer or trilayer UBM capture pads, followed by joining a lead-free solder thereto for providing lead-free solder joints that maintain reliability after multiple reflows. Optionally, the top layer of the trilayer UBM structures may include soluble or insoluble metals for doping the lead-free solder connections.