发明授权
US08003973B2 Connect and capacitor substrates in a multilayered substrate structure coupled by surface coulomb forces
有权
连接和电容器基板在通过表面库仑力耦合的多层基板结构中
- 专利标题： Connect and capacitor substrates in a multilayered substrate structure coupled by surface coulomb forces
- 专利标题（中）： 连接和电容器基板在通过表面库仑力耦合的多层基板结构中
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申请号： US12855184申请日： 2010-08-12
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公开(公告)号： US08003973B2公开(公告)日： 2011-08-23
- 发明人: Thaddeus John Gabara
- 申请人： Thaddeus John Gabara
- 申请人地址： US NJ Murray Hill
- 专利权人： MetaMEMS Corp.
- 当前专利权人： MetaMEMS Corp.
- 当前专利权人地址： US NJ Murray Hill
- 代理商 Thaddeus Gabara
- 主分类号： H01L29/06
- IPC分类号： H01L29/06
摘要：
A multi layered substrate structure can be formed where the substrates are coupled together using surface Coulomb forces. Connect substrates electrically connects signals and DC voltages between the substrates. The connect substrates bypass output/input buffers between two communicating substrates. The capacitor substrates provide a fully charged capacitor that provides additional energy to a levitated substrate if the capacitor substrate is connected to the levitated substrate. VLSI systems can also be build on each of the substrates.
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