发明授权
- 专利标题： Wafer spin chuck and an etcher using the same
- 专利标题（中）： 晶圆旋转卡盘和使用其的蚀刻器
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申请号： US12053908申请日： 2008-03-24
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公开(公告)号： US08007634B2公开(公告)日： 2011-08-30
- 发明人: Joo-Jib Park , Woo-Young Kim , Woo-Seok Lee
- 申请人： Joo-Jib Park , Woo-Young Kim , Woo-Seok Lee
- 申请人地址： KR
- 专利权人： Semes Co., Ltd.
- 当前专利权人： Semes Co., Ltd.
- 当前专利权人地址： KR
- 代理机构： Myers Bigel Sibley & Sajovec, P.A.
- 优先权： KR10-2007-0106257 20071022
- 主分类号： H01L21/027
- IPC分类号： H01L21/027 ; H01L21/304 ; B08B3/00
摘要：
A wafer spin chuck and an etcher using the same are provided. According to an aspect of the present invention, there is provide a wafer spin chuck device comprising: a spin body which spins a wafer; and a stationary body which holds the spin body and is under the spin body with a space between the spin body and the stationary body, wherein the stationary body includes a blocking unit which blocks the space with a fluid.
公开/授权文献
- US20090101285A1 WAFER SPIN CHUCK AND AN ETCHER USING THE SAME 公开/授权日：2009-04-23
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