Invention Grant
- Patent Title: Resist composition and method of forming resist pattern
- Patent Title (中): 抗蚀剂图案的抗蚀剂组成和方法
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Application No.: US11997527Application Date: 2006-07-10
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Publication No.: US08007981B2Publication Date: 2011-08-30
- Inventor: Ryoji Watanabe , Takehiro Seshimo , Takeshi Iwai
- Applicant: Ryoji Watanabe , Takehiro Seshimo , Takeshi Iwai
- Applicant Address: JP Kawasaki-shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe, Martens, Olson & Bear LLP
- Priority: JP2005-225805 20050803
- International Application: PCT/JP2006/313710 WO 20060710
- International Announcement: WO2007/015352 WO 20070208
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/004
Abstract:
A resist composition of the present invention is obtained by dissolving a resin component (A) that displays changed alkali solubility under action of acid and an acid generator component (B) that generates acid upon exposure in an organic solvent (S), wherein the organic solvent (S) includes an aromatic organic solvent (S1). According to the present invention, a resist composition and a method of forming a resist pattern, in which the level of LWR is reduced, can be provided.
Public/Granted literature
- US20100104972A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN Public/Granted day:2010-04-29
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