发明授权
- 专利标题： Pre-molded clip structure
- 专利标题（中）： 预成型夹结构
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申请号： US12822932申请日： 2010-06-24
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公开(公告)号： US08008759B2公开(公告)日： 2011-08-30
- 发明人: Erwin Victor Cruz , Maria Cristina B. Estacio
- 申请人： Erwin Victor Cruz , Maria Cristina B. Estacio
- 申请人地址： US ME South Portland
- 专利权人： Fairchild Semiconductor Corporation
- 当前专利权人： Fairchild Semiconductor Corporation
- 当前专利权人地址： US ME South Portland
- 代理机构： Kilpatrick Towsend & Stockton LLP
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/60
摘要：
A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed.
公开/授权文献
- US20100258924A1 PRE-MOLDED CLIP STRUCTURE 公开/授权日：2010-10-14
信息查询
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