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发明授权
US08012566B2 Microneedles formed by electroplating and selectively releasing temperature sensitive layers 失效
通过电镀和选择性释放温度敏感层形成的微针

Microneedles formed by electroplating and selectively releasing temperature sensitive layers
摘要：
Methods and structures including a release mechanism for use with the formation and then separation of a multi-layered structure are provided. The methods and structures provide for a master substrate on which is formed a temperature-sensitive release layer. A releasable structure is then formed on top of the temperature-sensitive release layer. The releasable structure can be freed from the master substrate by exposing the temperature-sensitive release layer to a temperature sufficient to soften or melt of the release layer.
摘要（中）：

提供了包括用于形成并分离多层结构的释放机构的方法和结构。 所述方法和结构提供了在其上形成温度敏感的释放层的母基板。 然后在温敏释放层的顶部形成可释放的结构。 通过将温度敏感的释放层暴露于足以软化或熔化释放层的温度，可释放的结构可以脱离母版基板。

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