A wafer level chip scale package system is provided including placing a first integrated circuit over a semiconductor wafer having a second integrated circuit; connecting a second electrical interconnect between the first integrated circuit and the second integrated circuit; forming a stress relieving encapsulant on the outer perimeter of the second integrated circuit for covering the second electrical interconnect; and singulating a chip scale package, from the semiconductor wafer, through the stress relieving encapsulant and the semiconductor wafer.