发明授权
- 专利标题: High mobility CMOS circuits
- 专利标题(中): 高移动性CMOS电路
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申请号: US11863757申请日: 2007-09-28
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公开(公告)号: US08013392B2公开(公告)日: 2011-09-06
- 发明人: Bruce B. Doris , Oleg G. Gluschenkov , Huilong Zhu
- 申请人: Bruce B. Doris , Oleg G. Gluschenkov , Huilong Zhu
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Roberts Mlotkowski Safran & Cole, P.C.
- 代理商 Joseph P. Abate
- 主分类号: H01L27/01
- IPC分类号: H01L27/01
摘要:
Semiconductor structure formed on a substrate and process of forming the semiconductor. The semiconductor includes a plurality of field effect transistors having a first portion of field effect transistors (FETS) and a second portion of field effect transistors. A first stress layer has a first thickness and is configured to impart a first determined stress to the first portion of the plurality of field effect transistors. A second stress layer has a second thickness and is configured to impart a second determined stress to the second portion of the plurality of field effect transistors.
公开/授权文献
- US20080237720A1 HIGH MOBILITY CMOS CIRCUITS 公开/授权日:2008-10-02
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