Invention Grant
- Patent Title: Shield structure for electronic device
- Patent Title (中): 电子设备屏蔽结构
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Application No.: US12327220Application Date: 2008-12-03
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Publication No.: US08014169B2Publication Date: 2011-09-06
- Inventor: Seiji Hamada , Masaaki Ofuji , Takatoshi Kubiura , Ichiro Hirose , Hirotsugu Fusayasu , Ryo Matsubara , Kei Ichikawa , Hiroshi Kunimoto
- Applicant: Seiji Hamada , Masaaki Ofuji , Takatoshi Kubiura , Ichiro Hirose , Hirotsugu Fusayasu , Ryo Matsubara , Kei Ichikawa , Hiroshi Kunimoto
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2007-313088 20071204
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
The present invention provides a shield structure for an electronic device allowing conductive members to be connected electrically to each other at low impedance while preventing the leakage of electromagnetic waves effectively. The first conductive member and the second conductive member for enclosing the electronic device respectively have laid portions that are laid one on the other and fastened to each other at plural positions by means of screw members. Through-holes into which the screw members are to be inserted are formed on both of the laid portions. Protruding portions, which protrude toward the laid portion of the second conductive member, each are formed between the adjacent through-holes on the laid portion of the first conductive member. The protruding portions each have a shape extending in the direction connecting the adjacent through-holes and bulging from both ends toward the center thereof in a smooth curve.
Public/Granted literature
- US20090141470A1 SHIELD STRUCTURE FOR ELECTRONIC DEVICE Public/Granted day:2009-06-04
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