发明授权
- 专利标题: Film removing device and film removing method
- 专利标题(中): 薄膜去除装置和薄膜去除方法
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申请号: US11831190申请日: 2007-07-31
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公开(公告)号: US08016976B2公开(公告)日: 2011-09-13
- 发明人: Shigenori Kamei , Kotaro Ooishi , Masahito Hamada
- 申请人: Shigenori Kamei , Kotaro Ooishi , Masahito Hamada
- 申请人地址: JP Tokyo-To
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP Tokyo-To
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2006-209421 20060801
- 主分类号: B29C63/00
- IPC分类号: B29C63/00
摘要:
A film removing device includes an approach stage having a flat approach part having a surface substantially flush with the surface of a substrate supported on a support member. The flat approach part faces a first side surface of the substrate at a corner of the substrate where the first side surface and a second side surface of the substrate join. A film removing nozzle spouts a solvent toward a peripheral part of the substrate and sucks a solution while being moved along the second side surface and the approach stage. A gas is spouted into a gap between the flat approach part and the corner of the substrate so that the gas flows through the gap toward the second side surface.
公开/授权文献
- US20080041523A1 FILM REMOVING DEVICE AND FILM REMOVING METHOD 公开/授权日:2008-02-21