Invention Grant
US08017489B2 Field effect structure including carbon alloyed channel region and source/drain region not carbon alloyed
有权
场效应结构包括碳合金通道区和源极/漏极区不是碳合金化
- Patent Title: Field effect structure including carbon alloyed channel region and source/drain region not carbon alloyed
- Patent Title (中): 场效应结构包括碳合金通道区和源极/漏极区不是碳合金化
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Application No.: US12047355Application Date: 2008-03-13
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Publication No.: US08017489B2Publication Date: 2011-09-13
- Inventor: William F. Clark, Jr. , Ephrem G. Gebgreselasie , Xuefeng Liu , Robert Russell Robison
- Applicant: William F. Clark, Jr. , Ephrem G. Gebgreselasie , Xuefeng Liu , Robert Russell Robison
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Richard M. Kotulak, Esq.
- Main IPC: H01L29/72
- IPC: H01L29/72

Abstract:
A semiconductor structure and a method for fabricating the semiconductor structure provide a field effect device structure. The field effect device structure includes a gate electrode located over a channel region within a semiconductor substrate that separates a plurality of source and drain regions within the semiconductor substrate. The channel region includes a surface layer that comprises a carbon doped semiconductor material. The source and drain regions include a surface layer that comprises a semiconductor material that is not carbon doped. The particular selection of material for the channel region and source and drain regions provide for inhibited dopant diffusion and enhanced mechanical stress within the channel region, and thus enhanced performance of the field effect device.
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