发明授权
US08017670B2 Epoxy resin composition for optical-semiconductor encapsulation, cured resin thereof, and optical semiconductor device obtained with the same
有权
用于光半导体封装的环氧树脂组合物，其固化树脂以及由其获得的光学半导体器件
- 专利标题： Epoxy resin composition for optical-semiconductor encapsulation, cured resin thereof, and optical semiconductor device obtained with the same
- 专利标题（中）： 用于光半导体封装的环氧树脂组合物，其固化树脂以及由其获得的光学半导体器件
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申请号： US11855267申请日： 2007-09-14
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公开(公告)号： US08017670B2公开(公告)日： 2011-09-13
- 发明人: Hisataka Ito , Shinya Ota , Kazuhiro Fuke , Shinjiro Uenishi
- 申请人： Hisataka Ito , Shinya Ota , Kazuhiro Fuke , Shinjiro Uenishi
- 申请人地址： JP Osaka
- 专利权人： Nitto Denko Corporation
- 当前专利权人： Nitto Denko Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2006-255410 20060921; JP2007-145913 20070531
- 主分类号： C08L63/00
- IPC分类号： C08L63/00 ; H01L21/00 ; C08K5/34
摘要：
The present invention relates to an epoxy resin composition for optical-semiconductor encapsulation which comprises the following ingredients (A) to (C): (A) an epoxy resin; (B) a curing agent; and (C) a naphthalocyanine colorant. The epoxy resin composition of the invention transmits visible rays and shields near infrared rays while retaining properties inherent in the epoxy resin.