发明授权
- 专利标题： Electrically shielded through-wafer interconnect
- 专利标题（中）： 电屏蔽透晶片互连
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申请号： US12063774申请日： 2006-08-15
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公开(公告)号： US08018067B2公开(公告)日： 2011-09-13
- 发明人: Roger Steadman , Gereon Vogtmeier , Ralf Dorsheid
- 申请人： Roger Steadman , Gereon Vogtmeier , Ralf Dorsheid
- 申请人地址： NL Eindhoven
- 专利权人： Koninklijke Philips Electronics N.V.
- 当前专利权人： Koninklijke Philips Electronics N.V.
- 当前专利权人地址： NL Eindhoven
- 优先权： EP05107848 20050826
- 国际申请： PCT/IB2006/052809 WO 20060815
- 国际公布： WO2007/023416 WO 20070301
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
Through-Wafer Interconnections allow for the usage of cost-effective substrates for detector chips. According to an exemplary embodiment of the present invention, detecting element for application in an examination apparatus may be provided, comprising a wafer with a sensitive region and a coaxial through-wafer interconnect structure. This may reduce the susceptibility of the interconnection by providing an effective shielding.
公开/授权文献
- US20100171196A1 ELECTRICALLY SHIELDED THROUGH-WAFER INTERCONNECT 公开/授权日：2010-07-08
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