发明授权
- 专利标题： Surface acoustic wave device, module device, oscillation circuit, and method for manufacturing surface acoustic wave device
- 专利标题（中）： 声表面波装置，模块装置，振荡电路及制造声表面波装置的方法
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申请号： US12905642申请日： 2010-10-15
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公开(公告)号： US08018122B2公开(公告)日： 2011-09-13
- 发明人: Takuya Owaki , Yuji Mitsui , Yuzuru Yoshizawa
- 申请人： Takuya Owaki , Yuji Mitsui , Yuzuru Yoshizawa
- 申请人地址： JP Tokyo
- 专利权人： Epson Toyocom Corporation
- 当前专利权人： Epson Toyocom Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Oliff & Berridge, PLC
- 优先权： JP2005-288987 20050930; JP2006-228768 20060825
- 主分类号： H03H9/25
- IPC分类号： H03H9/25
摘要：
An SH wave type surface acoustic wave device includes a piezoelectric substrate and an IDT electrode provided on the piezoelectric substrate and constituted of Al or an alloy mainly containing Al and that uses a SH wave as an excitation wave. The piezoelectric substrate is a crystal plate in which a cut angle θ of a rotary Y cut quartz substrate is set in a range of −64.0°
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