Invention Grant
US08019149B2 Pattern shape evaluation method and pattern shape evaluation apparatus utilizing the same
有权
图案形状评价方法和利用该图案形状评价装置的图案形状评价装置
- Patent Title: Pattern shape evaluation method and pattern shape evaluation apparatus utilizing the same
- Patent Title (中): 图案形状评价方法和利用该图案形状评价装置的图案形状评价装置
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Application No.: US12562173Application Date: 2009-09-18
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Publication No.: US08019149B2Publication Date: 2011-09-13
- Inventor: Hideaki Abe , Tadashi Mitsui
- Applicant: Hideaki Abe , Tadashi Mitsui
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2008-299890 20081125
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G01N21/86

Abstract:
A pattern shape evaluation method for deciding whether a pair of patterns are disconnected or connected. The method includes extracting a plurality of pattern contour points that make up a contour of a pattern in a measurement region, and creating two pattern contour point sequences based on the plurality of pattern contour points. Each of the two pattern contour point sequences includes a set of the pattern contour points. In the pattern contour point sequence, each of distances between neighboring pattern contour points is equal to or smaller than a predetermined value. The method includes calculating an angle between a line passing through two of the pattern contour points which provide a shortest distance between the two pattern contour point sequences and a reference line arbitrarily defined with respect to the measurement region. The method further includes deciding whether the patterns are disconnected or connected, based on the angle.
Public/Granted literature
- US20100128966A1 PATTERN SHAPE EVALUATION METHOD AND PATTERN SHAPE EVALUATION APPARATUS UTILIZING THE SAME Public/Granted day:2010-05-27
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