Invention Grant
- Patent Title: Lead fixation means
- Patent Title (中): 铅固定方式
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Application No.: US10772989Application Date: 2004-02-05
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Publication No.: US08019437B2Publication Date: 2011-09-13
- Inventor: Paul A. Iaizzo , Timothy G. Laske
- Applicant: Paul A. Iaizzo , Timothy G. Laske
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Carol F. Barry
- Main IPC: A61N1/04
- IPC: A61N1/04
Abstract:
A medical electrical lead includes a glue segment to adhere the lead to a treatment site. The glue segment, which may be disposed within a tip electrode of the lead, includes tissue adhesive which may encapsulated within a capsule.
Public/Granted literature
- US20050177220A1 Novel lead fixation means Public/Granted day:2005-08-11
Information query
