发明授权
- 专利标题: Polishing head and polishing apparatus having the same
- 专利标题(中): 具有相同的抛光头和抛光装置
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申请号: US12733535申请日: 2008-10-20
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公开(公告)号: US08021210B2公开(公告)日: 2011-09-20
- 发明人: Hisashi Masumura , Kouji Morita , Hiromasa Hashimoto , Satoru Arakawa , Hiromi Kishida
- 申请人: Hisashi Masumura , Kouji Morita , Hiromasa Hashimoto , Satoru Arakawa , Hiromi Kishida
- 申请人地址: JP Tokyo JP Nagano
- 专利权人: Shin-Etsu Handotai Co., Ltd.,Fujikoshi Machinery Corp.
- 当前专利权人: Shin-Etsu Handotai Co., Ltd.,Fujikoshi Machinery Corp.
- 当前专利权人地址: JP Tokyo JP Nagano
- 代理机构: Oliff & Berridge, PLC
- 优先权: JP2007-283864 20071031
- 国际申请: PCT/JP2008/002962 WO 20081020
- 国际公布: WO2009/057258 WO 20090507
- 主分类号: B24B49/00
- IPC分类号: B24B49/00
摘要:
The present invention is a polishing head in which a rubber film is formed in a boot shape in such a manner that a position where the rubber film is held by a mid plate is distantly positioned from a work holding portion; an end portion of the boot shaped rubber film is formed in O-ring shape so that the rubber film is held by the mid plate with decreasing an area of contact between the mid plate and the rubber film as much as possible. As a result, there is provided a polishing head with rubber chuck method in which an occurrence of a surface defect, such as a scratch, on a surface of the work is suppressed as much as possible and the work can be uniformly and stably polished to the outer periphery.
公开/授权文献
- US20100291838A1 POLISHING HEAD AND POLISHING APPARATUS HAVING THE SAME 公开/授权日:2010-11-18
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