发明授权
- 专利标题： Positive resist compositions and patterning process
- 专利标题（中）： 正极抗蚀剂组成和图案化工艺
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申请号： US12355072申请日： 2009-01-16
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公开(公告)号： US08021822B2公开(公告)日： 2011-09-20
- 发明人: Youichi Ohsawa , Takeshi Kinsho , Takeru Watanabe
- 申请人： Youichi Ohsawa , Takeshi Kinsho , Takeru Watanabe
- 申请人地址： JP Tokyo
- 专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 优先权： JP2008-008931 20080118
- 主分类号： G03F7/004
- IPC分类号： G03F7/004 ; G03F7/30
摘要：
A positive resist composition comprises (A) a resin component which becomes soluble in an alkaline developer under the action of an acid and (B) an acid generator. The resin (A) is a polymer comprising specific recurring units, represented by formula (1). The acid generator (B) is a specific sulfonium salt compound. When processed by lithography, the composition is improved in resolution and forms a pattern with a satisfactory mask fidelity and a minimal LER. Herein R1 is H or methyl, m is 1 or 2, and n is 1 or 2.
公开/授权文献
- US20090186296A1 POSITIVE RESIST COMPOSITIONS AND PATTERNING PROCESS 公开/授权日：2009-07-23
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